Advanced HEXFET® Power MOSFETs fromInternational Rectifier utilize advanced processingtechniques to achieve extremely low on-resistance persilicon area. This benefit, combined with the fastswitching speed and ruggedized device design thatHEXFET power MOSFETs are well known for, providesthe designer with an extremely efficient and reliabledevice for use in a wide variety of applications.The D2Pak is a surface mount power package capable ofaccommodating die sizes up to HEX-4. It provides thehighest power capability and the lowest possible onresistancein any existing surface mount package. TheD2Pak is suitable for high current applications because ofits low internal connection resistance and can dissipate upto 2.0W in a typical surface mount application.The through-hole version (IRF540NL) is available for lowprofileapplications.